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Ceramic PCB Specifications
| Parameter | Specification |
|---|---|
| PCB Type | Ceramic PCB |
| Ceramic Material | Alumina (Al₂O₃) / Aluminum Nitride (AlN) |
| Material Options | 96% Alumina / 99.6% Alumina |
| High Thermal Material | Aluminum Nitride (AlN) |
| Structure | Ceramic Substrate + Copper Circuit |
2. Thermal Performance
| Parameter | Specification |
|---|---|
| Al₂O₃ Thermal Conductivity | 20–30 W/m·K |
| AlN Thermal Conductivity | 140–180 W/m·K |
| Heat Dissipation | Excellent |
| Thermal Expansion Coefficient | Close to Silicon |
| High Temperature Resistance | Up to 500℃+ |
3. Ceramic Thickness
| Parameter | Specification |
|---|---|
| Substrate Thickness | 0.25mm – 2.0mm |
| Common Thickness | 0.635mm / 1.0mm / 1.5mm |
| Thickness Tolerance | ±10% |
4. Copper Circuit Layer
| Parameter | Specification |
|---|---|
| Copper Thickness | 10μm – 500μm |
| Copper Bonding Technology | DBC / DPC / Thick Film |
| Circuit Accuracy | High Precision |
| Fine Line Capability | Available |
5. Manufacturing Technology
| Process | Description |
|---|---|
| DBC | Direct Bond Copper Technology |
| DPC | Direct Plated Copper Technology |
| Thick Film | Screen Printing Technology |
| Laser Processing | Available |
| Precision Etching | Available |
6. Electrical Performance
| Parameter | Specification |
|---|---|
| Dielectric Strength | >10kV/mm |
| Insulation Resistance | ≥10¹² Ω |
| Low Dielectric Loss | Excellent |
| High Frequency Performance | Available |
7. Reliability
| Parameter | Specification |
|---|---|
| Operating Temperature | -55℃ ~ +500℃ |
| Thermal Shock Resistance | Excellent |
| Chemical Resistance | Excellent |
| Moisture Resistance | Excellent |
8. Ceramic PCB Applications
- High Power LED
- Semiconductor Equipment
- Laser Equipment
- Medical Electronics
- EV Power Electronics
- IGBT Modules
- RF & Microwave Devices
- Aerospace Electronics
